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    • Chiplets connected via the Universal Chiplet Interconnect Express
    EDA

    Demonstrating the UCIe Chiplet Interconnect

    Cadence's UCIe demo presents key features and interoperability support, and also discusses the future of chiplet technology in high-performance SoCs.

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    Photo 50268269 © Anyaivanova | Dreamstime.com

    Special Report: Sensors and AFEs

    Electronic Design explores the challenges and opportunities for future development of sensors and analog front ends in the upcoming Sensors and AFEs Week, starting June 3.

    Ideas for Design Vol. 3, No. 10 (Download)

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